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BGA(Ball Grid Array,球状矩阵排列)
CMOS: Complementary Metal Oxide Semiconductor,互补金属氧化物半导体
CISC(Complex Instruction Set Computing,复杂指令集计算机)
COB(Cache on board,板上集成缓存)
COD(Cache on Die,芯片内集成缓存)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPU:Center Processing Unit,中央处理器 EC(Embedded Controller,微型控制
器)
FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态
FIFO:First Input First Output,先入先出队列
FPU:Float Point Unit,浮点运算单元
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状矩阵封装
IA:Intel Architecture,英特尔架构 ID:identify,鉴别号码 IMM: Intel
Mobile Module, 英特尔移动模块
KNI(Katmai New Instructions,Katmai新指令集,即MMX2)
MMX:MultiMedia Extensions,多媒体扩展指令集
NI:Non-Intel,非英特尔
PGA: Pin-Grid Array(引脚网格阵列),耗电大
PSN(Processor Serial numbers,处理器序列号)
PIB: Processor In a Box(盒装处理器)
PPGA(Plastic Pin Grid Array,塑胶针状矩阵封装)
PQFP(Plastic Quad Flat Package)
RISC(Reduced Instruction Set Computing,精简指令集计算机)
SEC: Single Edge Connector,单边连接器
SIMD:Single Instruction Multiple Data,单指令多数据流
SiO2F(Fluorided Silicon Oxide,二氧氟化硅)
SOI: Silicon-on-insulator,绝缘体硅片
SSE(Streaming SIMD Extensions,单一指令多数据流扩充)
TCP: Tape Carrier Package(薄膜封装),发热小
TLBs(Translate Look side Buffers,翻译旁视缓冲器)
VLIW(Very Long Instruction Word,超长指令字)
WHQL: Microsoft Windows Hardware Quality Lab(微软公司视窗硬件质量实验室) |
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